thermal stress crack

Preferably, the burner is used to initiate the thermal stress crack, by increasing the power supplied to the glass.

优选地，利用燃烧器，通过增加供给给玻璃的能量，来启动热应力裂纹。

The result shows that the plastic strain at the heel region induced by wire bonding process, molding process and the thermal stress and strain in solder reflow are the main causes of heel crack.

结果显示由于引线键合工艺、注塑工艺以及回流焊中封装体各部分不同的热膨胀系数引起的热应力和塑性变形是产生引脚跟断裂的主要因素。

The complex function method is used to solve the temperature field and thermal stress field around the crack tip at the moment when the pulse current is switched on.

采用复变函数方法求解了脉冲放电瞬间裂纹尖端的温度场和热应力场。