low coefficient of thermal expansion

The application of the polyimide with low coefficient of thermal expansion in micro - electronics technology, soft - printing circuit plate were summarized.

综述了低热膨胀聚酰亚胺在微电子技术、柔性印刷电路板等方面的应用。

Synthetic diamond is competitive in heat dispersing materials, because it has high thermal conductivity, low coefficient of thermal expansion and lower price.

人造金刚石由于其自身高的热导率、低的热膨胀系数和相对低的价格已成为制造新型散热材料的研究热点。

Hypereutectic Al-Si alloy which has small proportion, low coefficient of thermal expansion, good wear resistance and dimensional stability is an ideal piston material.

过共晶铝硅合金比重小、热膨胀系数低、耐磨性和体积稳定性好，是理想的活塞材料。